Press Release
New Nano Spray technology from EVG achieves conformal coating of extreme surface topographies 2006-04-03 April 03, 2006 EV Group (EVG) a leading manufacturer of MEMS, Nano and Semiconductor wafer processing equipment announces a breakthrough achievement in new photoresist coating technology. With its new Nano Spray technology EVG has been able to demonstrate, for the first time, conformal coatings of vertical via walls 300µm deep and 100µm diameter. This new milestone in photoresist application will enable users to carryout further lithography steps in the bottom of the via to create through wafer interconnects and allow a new bandwidth of applications throughout many technologies in Semiconductor processing markets. While the coating of vertical features is common practice in MEMS technology it has also recently been used in the advanced packaging and interconnect arenas. Vias are used to interconnect the active front side of the wafer to the backside and further onto the pins of the specific wafer level package. This coating technology was first realized by EVG on their EVG100 series coating equipment by development and integration of new spray technology and techniques. Continuous technological improvements of the equipment have enabled the ability to coat even steeper sidewalls than was achievable in the past. Fulfilling these challenging coating requirements was achieved with a unique spray process that is based on a spray mist created by ultrasonic nozzles. To meet the further challenges of the advanced packaging and interconnect markets EVG has developed a completely new Nano Spray nozzle that enables significant improvement in refined dispense and targeted positioning of the spray stream. With this new coating system homogenous coatings of features 300µm deep and 100µm diameter can now be achieved. Further information on this new technology will be available at EVG´s booth at upcoming SEMICON shows. About EV Group
Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com. Contact
Markus Wimplinger
EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284
Phone: +1 480 727 9600
Fax: +1 480 727 9700
M.Wimplinger@EVGroup.com |
