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SmartView Wafer-to-Wafer Bond Aligner
   PRESS RELEASES:

Heptagon Micro-optics Pte Ltd. adopts EV Group's IQ Aligner

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Demands

This list includes all materials required by EV Group.
If you can offer us such products, please feel free to register as potential supplier!

Material groups

Description

Detail description

101

Mechanical parts

Bearings
Guides
Ball screw spindles
Gear teeth parts
Gears
Spindles
Couplings
Positioning elements
Piezos
Positioning systems
Operating controls
Springs
Foils
Vibration dampers
Suction cups
Linear measurement systems
Heating elements

102

Electronic parts

103

Pneumatic parts

104

Fluid parts

105

Vacuum parts

106

Optical parts

107

Raw materials

108

Chemical

109

Computer

116

Test material

   SEE ALSO:

NanoAlign Technology


LowTemp Plasma Bonding


Advanced-chip-to-wafer Technology (AC2W)


VLSI 10BEST 2006

 
   
   
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